IPC Moisture Sensitivity Classification for Non-IC Components. Content Provider Association Connecting Electronics Industries [IPC]. IPC, PWB Assembly Sol- dering Process Guideline for. Electronic Components. • IPC, Moisture Sensitiv- ity Classification for Non-IC. Components. and Use of Moisture/Reflow Sensitive Surface Mount Devices). This standard supersedes IPC Developed by ECA, IPC and JEDEC.
|Published (Last):||10 March 2005|
|PDF File Size:||2.41 Mb|
|ePub File Size:||7.16 Mb|
|Price:||Free* [*Free Regsitration Required]|
Documents Flashcards Grammar checker.
Best Commercial Practice Packaging of parts shall be sufficient to afford protection against deterioration and physical damage during shipment from the supply source to BAE Systems.
Use of individual bags or containers shall be used to insure adequate protection from physical contact with other parts. Use of newsprint, excelsior or loose fill expanded polystyrene shall be avoided as a means of cushioning. 953
Items that are gold plated or have a 16 finish or lower shall contain the following note marked on exterior of container: Do not handle with bare hands; use clean, lint free cotton gloves when handling. Elements or components that are Class 0 Ic shall be clearly marked as Class 0 on the external surface of the packaging. Use of any static generating material is strictly prohibited. Moisture Sensitive devices shall be packaged in moisture proof, conductive material or packaged in moisture proof antistatic material with external conductive field shielding barrier.
Oxide Sensitive devices shall be vacuum sealed in moisture proof antistatic material. Exterior containers shall comply with uniform freight and national motor freight classification rules or regulations or other carrier rules, as applicable to the mode of transportation. Leaded surface mount technology electronic components must be packaged such that component lead integrity is not adversely affected during shipping by contact with the packaging.
Additional information on this requirement can be found at the following site: Special Packaging Package parts per instructions specified by purchase order ipcc subcontracts, i. Surface mount components shall be suitable for vacuum pick up, include caps as applicable. For shelf life requirements beyond one year place a in the Q. An exception for through-hole radial components, bulkhead-mounted connectors, and cable connectors is best commercial practice.
Packaging Requirement Codes
Items which are ESD sensitive shall be individually, electrostatically protected using appropriate industrial practices. Use of newsprint, excelsior, or loosed fill expanded polystyrene shall be avoided as a means of cushioning. Iipc generating materials should be avoided. All components must be loaded into black static dissipative 2″x2″ waffle packs.
Waffle pack covers will also consists of black static dissipative material. With the notch of ipf waffle pack in the upper left hand corner, parts 950 be loaded left to right, and top to bottom. Waffle pack capacity should be maximized within a manufacturing lot. Parts do not have to be pre-oriented, but must be face up. Components will be covered with a lint free filter paper insert s between the top of the component and the bottom of the cover 4.
The preferred cavity size should be mils. Preferred cavity depth should not exceed more than 20 mils above the top of the component.
Minimum cavity depth is the same height as that of the component.
Suppliers should attempt to provide a best fit solution without incurring extensive tooling costs. If there are any questions contact Microwave Manufacturing Engineering. Once a Wafflepack is chosen all components of that size for the entire P. If there are any questions contact Microwave Manufacturing Engineering 6.
Matte finish waffle packs should be used if available. Waffle pack dimensions should remain the same for subsequent lots of the same component type. All waffle packs containing items that are ESD sensitive diodes, integrated circuits, etc. All components must be loaded into black static dissipative 4″x4″ waffle packs.
Components will be covered with a lintfree filter paper insert s between the top of the component and the bottom cover. Tape and Reel Only General Requirements: Orders over pieces must be supplied on a minimum of two 2 reels or minimum reel package quantity. Individual Comp Carrier General Requirements: A rigid container that holds one leaded component. The carrier shall be of a construction to allow component removal without tooling. These carriers shall support the body of the component, maintain ippc physical lead dimensions, and allow visibility of the contact shall be such that no ipv is applied to the leads.
The carrier shall be designed such that the component does not move when the carrier is opened and the lead configuration does not change once the component is removed from the carrier. Tubes Only General Requirements: Tubes for Surface-Mounted Components Definition: A carrier that holds multiple components in a row.
Packaging Requirement Codes
All the components shall icp oriented in 903 same direction according to polarity or pin one markings. The packaging shall allow the polarity or part number markings to be visible for each device. The carrier shall have removable stops on each end and shall prevent the components from shifting in any direction.
Matrix Tray General Requirements: An ESD Package with indented pockets that house the components. The parts must not be held in the pockets by supplementary means within the tray. The lid must be capable of being removed without disturbing the parts within the tray and the part no. A maximum of 5 devices shall be contained in a tray.
SMI only General Requirements: This code i;c only be used on product provided by through Integrated Supplier Partnering Agreements. Specific packaging requirements will be provided by the using factory through the supplier electronic replenishment process.
Items that are ESD sensitive shall be individually, electrostatically protected using appropriate industrial practices. Use of newsprint, excelsior, or loosed fill expanded polystyrene is not allowed as 950 means of cushioning. All components must be loaded into black static dissipative 2″x2″ icp release trays. Tray covers will also consists of black static dissipative material held to the base with a one piece clip.
Parts must be loaded consecutively from left to right, proceeding from top to bottom as viewed with the notch of the waffle pack positioned in the upper left hand corner with a consistent separation between rows and columns.
Tray capacity will be indicated on the purchase request.
IPC – Moisture Sensitivity Classification for Non-IC Components
Parts should be pre-oriented, but must be face up. Components will be covered with a lint free filter paper insert s between the top of the component and the bottom of the cover. The Gel retention level must be the minimum required to hold the component with a mesh size that adequately supports the component and allows the component to be released with vacuum applied.
Once a Tray is chosen all components of that size for the entire P. Gel Trays must be 950 on the cover and 5903 bottom of the base with the supplier lot number and part number, PO number and BAE part number.
Gel Trays should remain the same for subsequent lots of the same component type. Each moisture barrier bag may contain up to 10 PWBs of size in2 per side or greater, and smaller boards may be packaged up to 25 per bag. Multiple boards in an MBB shall be separated by slip sheets or other appropriate materials such as pink poly bags. Each moisture barrier bag shall be marked with the part number, date code, quantity, and serial numbers of the PWBs enclosed.
Moisture content prior to packaging shall not exceed 0.
Moisture content may be assured by documented process controls or appropriate testing. Moisture transfer refers to the fact that certain solid waste So typically paper as it enters the waste stream Compliance Commitments related to the manufacture and. Basin and Lpc Province PowerPoint. Solid board packaging is ideal for achieving exclusive.